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DATA SHEET
PC29M33A,PC29M05A
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR
BIPOLAR ANALOG INTEGRATED CIRCUIT
DESCRIPTION
The PC29M33A, PC29M05A of low dropout voltage three terminal positive regulators is constructed with PNP output transistor. The PC29M33A, PC29M05A feature the ability to source 0.5 A of output current with a low dropout voltage of typically 0.5 V. The power dissipation of the PC29M33A, PC29M05A can be drastically reduced compared with the conventional three terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to the low voltage output (3 V, 3.3 V) which is not in the conventional low dropout regulators ( PC24M00A series).
FEATURES
* Output current in excess of 0.5 A * Low dropout voltage VDIF = 0.5 V TYP. (at IO = 0.5 A) * On-chip overcurrent and thermal protection circuit * On-chip output transistor safe area protection circuit
PIN CONFIGURATION (Marking Side)
PC29M33AHF, PC29M05AHF: MP-45G
PC29M33AHB, PC29M05AHB: MP-3 PC29M33A, PC29M05AT: MP-3Z
4
1
2
3 1: INPUT 2: GND 3: OUTPUT
1
2
3
1: 2: 3: 4:
INPUT GND OUTPUT GND (Fin)
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. G15368EJ1V0DS00 (1st edition) Date Published May 2001 NS CP(K) Printed in Japan
(c)
2001
PC29M33A,PC29M05A
BLOCK DIAGRAM
INPUT
Safe operating area protection Start-up circuit Reference voltage
Error amp.
Drive circuit
Saturation protection OUTPUT
Thermal shut down Over current protection GND
2
Data Sheet G15368EJ1V0DS
PC29M33A,PC29M05A
ORDERING INFORMATION
Part Number Package MP-45G (Isolated TO-220) Output Voltage 3.3 V Marking 29M33A Package Type * Packed in envelope
PC29M33AHF
PC29M33AHB PC29M33AT PC29M33AT-E1
MP-3 (SC-64) MP-3Z (SC-63) MP-3Z (SC-63)
3.3 V 3.3 V 3.3 V
29M33A 29M33A 29M33A
* Packed in envelope * Packed in envelope * 16 mm wide embossed taping * Pin 1 on drawout side * 2000 pcs/reel
PC29M33AT -E2
MP-3Z (SC-63)
3.3 V
29M33A
* 16 mm width embossed taping * Pin 1 at takeup side * 2000 pcs/reel
PC29M33AT -T1
MP-3Z (SC-63)
3.3 V
29M33A
* 32 mm wide adhesive taping * Pin 1 at drawout side * 1500 pcs/reel
PC29M33AT -T2
MP-3Z (SC-63)
3.3 V
29M33A
* 32 mm wide adhesive taping * Pin 1 at takeup side * 1500 pcs/reel
PC29M05AHF
MP-45G (Isolated TO-220)
5.0 V
29M05A
* Packed in envelope
PC29M05AHB PC29M05AT PC2905AT-E1
MP-3 (SC-64) MP-3Z (SC-63) MP-3Z (SC-63)
5.0 V 5.0 V 5.0 V
29M05A 29M05A 29M05A
* Packed in envelope * Packed in envelope * 16 mm wide embossed taping * Pin 1 at drawout side * 2000 pcs/reel
PC2905AT-E2
MP-3Z (SC-63)
5.0 V
29M05A
* 16 mm wide embossed taping * Pin 1 at takeup side * 2000 pcs/reel
PC2905AT-T1
MP-3Z (SC-63)
5.0 V
29M05A
* 32 mm wide adhesive taping * Pin 1 at drawout side * 1500 pcs/reel
PC2905AT-T2
MP-3Z (SC-63)
5.0 V
29M05A
* 32 mm wide adhesive taping * Pin 1 at takeup side * 1500 pcs/reel
Data Sheet G15368EJ1V0DS
3
PC29M33A,PC29M05A
ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise specified)
Rating Parameter Symbol
PC29M33AHF, PC29M05AHF
PC29M33AHB, PC29M05AHB PC29M33AT, PC29M05AT
Unit
Input Voltage Internal Power Dissipation
Note
VIN (TC = 25C) PT TA TJ Tstg Rth(J-C) Rth(J-A) 7 65 15
20 10 -30 to +85 -30 to +150 -55 to +150 12.5 125
V W C C C C/W C/W
Operating Ambient Temperature Operating Junction Temperature Storage Temperature Thermal Resistance (junction to case) Thermal Resistance (junction to ambient)
Note Internally limited. When the operating junction temperature rises over 150C, the internal circuit shuts down the output voltage. Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the quality of the product may be degraded. In other words, absolute maximum ratings specify the values exceeding which the product may be physically damaged. Be sure to use the product with these ratings never exceeded.
STANDARD CONNECTION
D1
INPUT
PC29M33A, PC29M05A + CIN COUT D2
OUTPUT
CIN: 0.1 F or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure to connect CIN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 F or higher for the voltage and temperature range to be used. COUT: 47 F or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN and COUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low impedance characteristics if considering use at sub-zero temperatures. D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode. Caution Make sure that no voltage is applied to the OUTPUT pin from external.
4
Data Sheet G15368EJ1V0DS
PC29M33A,PC29M05A
RECOMMENDED OPERATING CONDITIONS
Parameter Input Voltage Symbol VIN Type Number MIN. 4.3 6 0 -30 -30 TYP. MAX. 16 16 0.5 +85 +125 A C C Unit V
PC29M33A PC29M05A
Output Current
IO
All All All
Operating Ambient Temperature TA Operating Junction Temperature TJ
ELECTRICAL CHARACTERISTICS
PC29M33A (TJ = 25C, VIN = 5 V, IO = 350 mA, CIN = 0.22 F, COUT = 47 F, unless otherwise specified)
Parameter Output Voltage Symbol VO 0C TJ 125C, 4.3 V VIN 16 V, 0 A IO 350 mA 0C TJ 125C, 0 A IO 0.5 A Line Regulation Load Regulation Quiescent Current REGIN REGL IBIAS 4.3 V VIN 16 V 0 A IO 0.5 A IO = 0 A IO = 0.5 A Startup Quiescent Current IBIAS (s) VIN = 3.1 V, IO = 0 A VIN = 3.1 V, IO = 0.5 A Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current 8 10 1.8 15 9 33 33 3.0 20 20 50 2.9 56 48 64 0.5 0.7 1.1 0.6 0.7 0.6 1.2 1.0 -0.4 1.5 1.5 mV/C A 1.0 1.5 15 mA mA mA mV Conditions MIN. 3.18 3.14 TYP. 3.3 MAX. 3.42 3.46 Unit V
IBIAS
Vn R*R VDIF IOpeak
0C TJ 125C, 4.3 V VIN 16 V 10 Hz f 100 kHz 4.3 V VIN 16 V, f = 120 Hz 0C TJ 125C, IO = 0.5 A VIN = 4.5 V VIN = 16 V
Vr.m.s.
dB V A
Peak Output Current
IOpeak
VIN = 4.5 V VIN = 16 V
Temperature Coefficient of Output Voltage
VO /T
0C TJ 125C, IO = 5 mA
Data Sheet G15368EJ1V0DS
5
PC29M33A,PC29M05A
PC29M05A (TJ = 25C, VIN = 8 V, IO = 350 mA, CIN = 0.22 F, COUT = 47 F, unless otherwise specified)
Parameter Output Voltage Symbol VO 0C TJ 125C, 6 V VIN 16 V, 0 A IO 350 mA 0C TJ 125C, 0 A IO 0.5 A Line Regulation Load Regulation Quiescent Current REGIN REGL IBIAS 6 V VIN 16 V 0 A IO 0.5 A IO = 0 A IO = 0.5 A Startup Quiescent Current IBIAS (s) VIN = 4.5 V, IO = 0 A VIN = 4.5 V, IO = 0.5 A Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current 26 17 1.9 15 10 50 50 4.0 20 20 50 2.4 87 46 60 0.5 0.65 1.1 0.6 0.7 0.6 1.2 1.1 0.7 1.5 1.5 mV/C A 1.0 1.5 15 mA mA mV mV mA Conditions MIN. 4.83 4.75 TYP. 5.0 MAX. 5.18 5.25 Unit V
IBIAS
Vn R*R VDIF IOpeak
0C TJ 125C, 6 V VIN 16 V 10 Hz f 100 kHz 6 V VIN 16 V, f = 120 Hz 0C TJ 125C, IO = 0.5 A VIN = 6.5 V VIN = 16 V
Vr.m.s.
dB V A
Peak Output Current
IOpeak
VIN = 6.5 V VIN = 16 V
Temperature Coefficient of Output Voltage
VO /T
0C TJ 125C, IO = 5 mA
6
Data Sheet G15368EJ1V0DS
PC29M33A,PC29M05A
TYPICAL CHARACTERISTICS (Reference Values)
Pd vs. TA
20
Pd - Total Power Dissipation - W
VO - Output Voltage Deviation - mV
Solid line: PC29M33AHF, PC29M05AHF Broken line: PC29M33AHB , PC29M05AHB PC29M33AT , PC29M05AT
VO vs TJ 150 100 50
15
With infinite heatsink
PC29M05A
0 -50 -100 -150 IO = 5 mA -200 -50
10
PC29M33A
5
Without heatsink
0
0
25
50
75
100
125
150
TA - Operating Ambient Temperature - C
50 0 100 TJ - Operating Junction Temperature - C
150
VO vs. VIN (PC29M33A) 4.0 I O = 5 mA 3.5 I O = 0.35 A TJ = 25C 7 8
VO vs. VIN (PC29M05A) TJ = 25C I O = 0.5 A 6
VO - Output Voltage - V
I O = 0.5 A 2.5 2.0 1.5 1.0 0.5 0 0 1 2 3 4 5 6 VIN - Input Voltage - V 7 8
VO - Output Voltage - V
3.0
I O = 0.35 A I O = 5 mA
5 4 3 2 1 0 0 1 2 3 4 5 6 VIN - Input Voltage - V 7 8
IBIAS (IBIAS(s)) vs. VIN ( PC29M33A) 50 TJ = 25C
IBIAS - Quiescent Current - mA
IBIAS - Quiescent Current - mA
IBIAS (IBIAS(s)) vs. VIN (PC29M05A) 50 T = 25C 40
40
30
30
20 I O = 0.5 A 10 I O = 0.35 A IO= 0 A
20 I O = 0.5 A 10 I O = 0.35 A
0 0 2 4 6 8
O
=0A 16 18 20
0 10 12 14 16 18 20 0 2 4 VIN - Input Voltage - V 6 8 10 12 14 VIN - Input Voltage - V
Data Sheet G15368EJ1V0DS
7
PC29M33A,PC29M05A
VDIF vs. TJ 1.0
IOpeak vs. VDIF (PC29M33A)
1.5
VDIF - Dropout Voltage - V
0.8
IOpeak - Peak Output Current - A
1.0 TJ = 0C TJ = 25C 0.5 TJ = 125C
0.6
PC29M05A
0.4
PC29M33A
0.2 I O = 0.5 A 0 -25 0 25 50 75 100 125 150
0.0 0 5 10 15 VDIF - Dropout Voltage - V 20
TJ - Operating Junction Temperature - C
IOpeak vs. VDIF (PC2905A)
1.5
R*R vs f
80 70
PC29M33A
IOpeak - Peak Output Current - A
TJ = 0C 1.0
R*R - Ripple Rejection - dB
60 50 40 30 20
TJ = 25C
PC29M05A
0.5 TJ = 125C
TJ = 25C, IO = 0.5 A 4.3 V VIN 16 V PC29M33A 6 V VIN 16 V PC29M05A
0.0 0 5 10 15 20 VDIF - Dropout Voltage - V
0 10 100 1k 10 k 100 k
f - Frequency - Hz
R R vs. IO 80
.
VDIF vs. IO 1.0 TJ = 25C
. R - Ripple Rejection - dB
PC29M33A
60
VDIF - Dropout Voltage - V
70
0.8
0.6
PC29M05A
50
TJ = 25C, f = 120 Hz 4.3 V VIN 16 V PC29M33A 6 V VIN 16 V PC29M05A
0.4
PC29M33A
R
40
0.2
PC29M05A
30 0 0.1 0.2 0.3 0.4 0.5
IO - Output Current - A
0 0 0.1 0.2 0.3 0.4 0.5
IO - Output Current - A
8
Data Sheet G15368EJ1V0DS
PC29M33A,PC29M05A
VO vs. IO ( PC29M33A) 6 TJ = 25C 5
5
VO - Output Voltage - V
VO vs. IO (PC29M05A) 6 TJ = 25C VIN = 8V
VO - Output Voltage - V
4 V =5V 3 2 VIN = 16 V 1
VIN = 4.3 V
4 3 VIN = 16 V 2 VIN = 6 V 1
0
0.2
0.4
0.6
0.8
1.0
1.2
0
0.2
IO - Output Current - A
0.4 0.6 0.8 IO - Output Current - A
1.0
1.2
Data Sheet G15368EJ1V0DS
9
PC29M33A,PC29M05A
PACKAGE DRAWINGS
PC29M33AHF, PC29M05AHF
3PIN PLASTIC SIP (MP-45G)
A E B P N
I L
D
1 2 3
M
K
Y
H Z C F
NOTE
J
V
U
G
M
ITEM A B C D E F G H I J K L M N P U V Y Z
MILLIMETERS 10.00.2 7.00.2 1.500.2 17.00.3 3.30.2 0.750.10 0.25 2.54 (T.P.) 5.00.3 2.460.2 5.00.2 8.50.2 8.50.2 4.50.2 2.80.2 2.40.5 0.650.10 8.90.7 1.300.2 P3HF-254B-4
Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition.
10
Data Sheet G15368EJ1V0DS
PC29M33A,PC29M05A
PC29M33AHB, PC29M05AHB
MP-3 (SC-64) (Unit: mm)
5.00.2 4
1.5 +0. 2 -0. 1
6.50.2
2.30.2
0.50.1
1.60.2
1.10.1
0.5 +0.2 -0.1 2.3 2.3
7.0 MIN.
13.7 MIN.
1
2
3
5.50.2
0.5 +0.2 -0.1
PC29M33AT, PC29M05AT
MP-3Z (SC-63) (Unit: mm )
0.75
6.50.2 5.00.2
2.30.2
1.5 -0.1
+0.2
0.50.1
4
4.3 MAX.
10.0 MAX.
5.50.2
1
2
3
0.8
2.0 MIN.
1.10.2 2.3 2.3
0.9 MAX.
0.8 MAX.
0.8
0.5
1.0 MIN. 1.5 TYP.
Data Sheet G15368EJ1V0DS
11
PC29M33A,PC29M05A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Surface Mount Device
PC29M33AT, PC29M05AT: MP-3Z (SC-63)
Process Infrared Ray Reflow Conditions Peak temperature: 235C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210C or higher), Maximum number of reflow processes: 2 times or less. Vapor Phase Soldering Peak temperature: 215C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200C or higher), Maximum number of reflow processes: 2 times or less. Wave Soldering Solder temperature: 260C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120C or below (Package surface temperature). Partial Heating Method Pin temperature: 300C or below, Heat time: 3 seconds or less (Per each side of the device). - WS60-00-1 VP15-00-2 Symbol IR35-00-2
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Through-hole devices
PC29M33AHF, PC29M05AHF: MP-45G PC29M33AHB, PC29M05AHB: MP-3
Process Wave soldering (only to leads) Partial heating method Solder temperature: 260C or below, Flow time: 10 seconds or less. Pin temperature: 300C or below, Heat time: 3 seconds or less (Per each pin).
Conditions
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.
12
Data Sheet G15368EJ1V0DS
PC29M33A,PC29M05A
NOTES ON USE
When the PC29M33A, PC29M05A are used with an input voltage that is lower than the value indicated in the recommended operating conditions, a large quiescent current flows through the device due to saturation of the transistor of the output stage. (Refer to the IBIAS (IBIAS(S)) vs. VIN curves in TYPICAL CHARACTERISTICS). These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device. Thus the power supply on the input side must have sufficient capacity to allow this quiescent current to pass when the device starts up.
REFERENCE DOCUMENTS
Document Name QUALITY GRADE ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL VOLTAGE REGULATOR OF SMD SEMICONDUCTOR SELECTION GUIDE - PRODUCTS AND PACKAGES Document No. C11531E C10535E G11872E X13769E
Data Sheet G15368EJ1V0DS
13
PC29M33A,PC29M05A
[MEMO]
14
Data Sheet G15368EJ1V0DS
PC29M33A,PC29M05A
[MEMO]
Data Sheet G15368EJ1V0DS
15
PC29M33A,PC29M05A
* The information in this document is current as of May, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

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